Fully Equipped Wafer Fabrication Plant located at STMicroelectronics Inc.:
Capacity to produce 45,000 150mm wafers (easily upgradeable to 200mm) per month. Logic and Mixed Signal Technology producing 0.45um BiCMOS and CMOS Technology along with HIGHLY DESIRABLE significant production of MEMS products.

Exceptionally well-maintained facility and equipment producing World Class Yield.

Deposition Area: Multiple ASM Epsilon 2000 Reactors, Bruce Horizontal Furnaces, SVG VTR and TEL Vertical Furnaces

Automated Wet Cleaning: FSI Mercury, Akrion Automated Gama benches, Semitool Solvent Strip and Raider Electroplating

Etching: AMAT Centura and P5000 for Tungsten Etch Back , Lam Alliance, TCP and Rainbow Dry Etch Technology for Oxide, Silicide and Aluminium Etch

Deposition Technology: AMAT Endura, Aluminum and Silicide, Centura and Novellus C1 and C2- Dielectric and Tungsten

Implant Technology: Axcelis NV-GSD 200 HE and 8250 Series

Photolithography: ASML model 2500/50 to 5500/250 Steppers with DNS integrated and stand alone wafer tracks. KLA-Tencor measurement equipment.

Probe and Test Area: Well-established Back end Parametric test and Probe floor

For further information, please contact:
Duncan Ainscough
Binswanger GoIndustry-DoveBid
New London Bridge House
25 London Bridge Street
London, SE1 9BQ
UK Tel: +44 (0) 44 207 098 3700
Mobile: +44 (0) 7785 221919
duncan.ainscough@goindustry.com

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